mgm美高梅79906 > mgm美高梅79906 > 覆铜板
覆铜板
COPPER CLAD LAMINATES
规格值
序号 |
产品系列 |
产品名称 |
产品简要描述 |
Dk@10GHz |
Df@10GHz |
1 |
Mid-loss |
H175HF |
中等介质损耗,高耐热无卤材料 |
4.0 |
0.012 |
2 |
Mid-loss |
H175HFZ |
中等介质损耗,高耐热无卤材料 |
4.0 |
0.010 |
3 |
Low-loss |
H180HF |
低介质损耗,高耐热无卤材料 |
3.9 |
0.007 |
4 |
Low-loss |
H185HF |
低介质损耗,高耐热无卤材料 |
3.9 |
0.007 |
5 |
Very Low-loss |
H360 |
超低介质损耗,低介电常数,高耐热材料 |
3.65 |
0.0048 |
6 |
Very Low-loss |
H190HF |
超低介质损耗,低介电常数,高耐热无卤材料 |
3.85 |
0.0052 |
7 |
Very Low-loss |
H360(Z) |
超低介质损耗,低介电常数,高耐热材料 |
3.65 |
0.0045 |
8 |
Ultra Low-loss |
HSD7 |
超低介质损耗,低介电常数,高耐热材料 |
3.53 |
0.004 |
9 |
Ultra Low-loss |
HSD7(K) |
超低介质损耗,低介电常数,高耐热材料 |
3.37 |
0.0021 |
10 |
Ultra Low-loss |
HSD7JA(K) |
超低介质损耗,低介电常数,高耐热材料 |
3.16 |
0.0018 |
11 |
Ultra Low-loss |
H350 |
超低介质损耗,低介电常数,低膨胀高耐热材料 |
3.53 |
0.0039 |
12 |
Ultra Low-loss |
H350(K) |
超低介质损耗,低介电常数,低膨胀高耐热材料 |
3.37 |
0.002 |
13 |
Extreme Low-loss |
HSD8 |
极低介质损耗,低介电常数,低膨胀高耐热材料 |
3.15 |
0.0012 |
14 |
Extreme Low-loss |
HSD8(K) |
极低介质损耗,低介电常数,低膨胀高耐热材料 |
3.25 |
0.0014 |